3D laser profile scanner now with optional Ethernet connectivity

Micro-Epsilon has launched a new version of its popular 3D laser profile scanner, the scanCONTROL 2700, which is now available with an Ethernet interface as standard. FireWire is still available if preferred.

For users who regularly work with open connectivity systems, the new Ethernet network option is ideal. Using this interface, the laser profile scanner can be quickly integrated to existing industrial networks. The configuration of the scanner is carried out using a supplied configuration programme, which enables the scanner to be configured to a unique IP address. This means the profile data transmission can also be performed via this interface.

The scanCONTROL 2700.

The scanCONTROL 2700 provides up to 64,000 calibrated measuring points per second in real time via an Ethernet or FireWire interface, without requiring any additional hardware (controller). The software development kit (SDK) and function library (LLT.dll) supplied as standard with the sensor provide the user with a communications platform that offers maximum flexibility and performance via direct integration with most common programming languages.
 
The scanCONTROL 2700 series of laser profile scanners is available with measuring ranges of 25mm, 50mm and 100mm. The models in the 2700 series have a compact housing with an integrated controller and offer an attractive price/performance ratio. This compact design means the scanner is suitable for a wide range of machine designs and automation systems, where space is often restricted.
 
Unlike many laser profile scanner on the market that have an external controller, the scanCONTROL 2700 offers users the most compact design possible. For applications in which multiple sensors are required or if the sensor needs to be mounted on a moving object such as a motorised stage or robot, the compactness and performance of the sensor is unsurpassed.
 
Typical applications for the scanCONTROL 2700 are the measurement of angles, steps and positions. The sensors are also used to measure profiles such as adhesive beads, weld seams, grooves and gaps. Here, the scanCONTROL 2710 version can be ordered, which calculates these parameters inside the sensor itself and then outputs the calculated value as either digital or analogue signals.
 
For further information on Micro-Epsilon's scanCONTROL 2700 range of sensors, e-mail: info@micro-epsilon.co.uk  Refer to next page

High temperature electronics packaging solutions for 250ºC applications

Packaging and assembly systems that can withstand 250ºC for prolonged durations have been developed through the UPTEMP Technology Strategy Board project as part of a project to extend electronics into hostile high temperature environments.

There is a growing desire to install electronic power and control systems in high temperature environments to improve the accuracy of critical measurements and reduce the cost of cabling from remote and hostile locations. Typical applications include down-hole petroleum/gas/geothermal exploration and production operations and turbine engines for aircraft propulsion and power generation.

This requirement has posed a challenge to the traditional limit of 125ºC for high temperature exposure of electronics systems. The leap in operating temperature to above 200ºC in combination with high pressures, vibrations and potentially corrosive env ronments means that different semiconductors, passives, circuit boards and assembly processes are needed. 

The fundamental change required to enable this step change in packaging performance is to switch from traditional soldered surface mount or through-hole packaged devices assembled onto FR4 printed circuit board materials. Instead, designers and manufacturers should use bare dies mounted onto ceramic, insulated metal or polyimide based substrates with selected materials that are intrinsically more capable of withstanding high temperatures for long periods without degradation. 

Extensive testing of ceramic and insulated metal substrates and solder/adhesive interconnect materials at temperatures of 250ºC for durations of over 2,000 hours have been carried out. Thermal migration and other deterioration effects have been observed on several commercially available high temperature materials and commonly used assembly methods. An alternative set of materials and assembly processes have been developed with proven reliability at temperatures of up to 250ºC for the manufacture of active and passive electronic components, suitable for down-well, aero-engine and power generation applications.

This work formed part of the recently-completed UPTEMP project which was established with support from the UK Technology Strategy Board and the EPSRC. The project brought together a consortium of end-users (Sondex Wireline and Vibro-Meter UK), an electronic module manufacturer (GE Aviation Systems - Newmarket) and material suppliers (Gwent Electronic Materials and Thermastrate Ltd) with Oxford University's Materials Department, the leading UK high temperature electronics research centre.

Refer to pictures above: (Top) Electrical testing of high temperature electronic devices. (Centre) Inspection of high temperature electronic devices. (Bottom) Wire bonding of high temperature electronic devices.

For further information, e-mail: steve.riches@ge.com or view website: www.electroniccomponents.geaviationsystems.com   Refer to page 180

MIRTEC wins 150 machine purchase order at SMT/PCB NEPCON Korea

MIRTEC, "The Global Leader in Inspection Technology," announces that the company was awarded a 150 machine purchase order with a leading mobile solution manufacturer at SMT/PCB NEPCON Korea.

"We at MIRTEC continue to invest heavily in R&D persistently focused on addressing the high-density PCB manufacturing requirements associated with today's most advanced mobile products," stated MIRTEC CEO Chanwha Pak. "We are very proud of our continued success in this very competitive market segment."  (Mr Chanwha Pak is pictured on the left).

Brian D'Amico, president of MIRTEC's North American sales and service division, added, "We are very pleased that our products have found widespread acceptance among the industry's leading mobile solution providers. This is an extremely remarkable achievement in light of the fact that there are more than 25 competitors in the highly volatile inspection equipment industry."

MIRTEC's competitive advantages include leading-edge optics and laser inspection technologies, a diversified customer base and vertical market exposure along with an expanded geographic presence. MIRTEC products have been extremely successful in high-volume markets including cell phone and MP3 player manufacturing, as well as low-volume, high-mix markets such as medical, automotive, aerospace and defense.

Testament to MIRTEC's exceptional product offering, strong global sales network and outstanding customer support, MIRTEC recorded 96 percent growth in global sales revenue for 2010, reportedly earning the company second place in global market share for total AOI and SPI sales revenue throughout 2010. With a combined installed base of several thousand systems, and projected sales of more than 1,000 systems per year, the company is rapidly gaining market share and establishing its leadership position. For further information contact, Brian D'Amico, MIRTEC Corporation, website: http://www.mirtecusa.com

The ProLINE-RoadRunner™ from Data I/O GmbH

The ProLINE-RoadRunner™ from Data I/O GmbH, the leading provider of manual and automated device programming solutions, is a high speed automated inline programming feeder that mounts directly onto an SMT machine without consuming any additional floor space or altering the production line. The RoadRunner removes unprogrammed Flash Memory devices from tape, programs four devices in parallel, and then delivers the programmed parts to the pick-up point of the placement machine. The RoadRunner is a Just-In-Time inline programming system and features FlashCORE III, the fastest flash programming architecture available on the market today. Data I/O products currently support the ProLINE-RoadRunner™, on Siemens SIPLACE assembly machines, Fuji assembly machines, Universal Instruments GSM platform, and Assembleon platforms. In addition, the programmer provides a dramatic reduction in inventory carrying and rework costs, as well as a rapid ROI in only a matter of months. 

With support for the latest flash memory devices including SD, MMC, MoviNAND and iNAND, FlashCORE III is the best programming engine on the market supporting large devices and provides significant performance gains by increasing the download and read/write speeds by a factor of ten. High-density devices and file sizes are increasing at an exponential rate in the automotive and consumer electronic markets and FlashCORE III eliminates production bottlenecks by delivering vital production throughput gains to customers using cutting edge devices in their products. FlashCore III provides the capability to program the latest NAND Flash devices in approximately a one-tenth the time of FlashCore II. As devices get faster, we upgrade the FlashCore hardware/firmware to stay ahead with the technology.

Data I/O's automated handling systems, the manual programmer FlashPAK III and the Process Control software applications all support FlashCORE III. This allows customers to seamlessly transfer job profiles (algorithms, data files and programming parameters) from design through manufacturing. FlashPAK III™, Data I/O's Networked Programming System supports the latest high-density flash memory, NAND flash, Managed NAND Flash, Microcontroller and EEPROM devices at maximum programming speeds and highest quality per device keeping your production processes running at maximum velocity.

FlashPAK III is the third generation programming architecture extending Data I/O's unique design for high-speed flash support. In addition to the huge library of existing FlashPAK support for Flash, NAND and Microcontrollers, the FlashPAK III adds the capability to efficiently program all types of managed NAND devices like MoviNAND, iNAND, eMMC etc., and devices of any size. FlashPAK III is designed to give the highest production throughput possible. FlashPAK III is capable of reading and writing to devices at speeds greater than ten MBytes/second. In addition, the job download speed has been improved dramatically to enable fast job changeovers.

Finally, the field configurable FPGA can be optimized for any device. The standalone system is ideal for first article builds and NPI applications. As products move to higher volume production, the programming tasks can be easily transferred to Data I/O's automated FlashCORE programming systems without altering the programming itself.

For further information on Data I/O GmbH, view website: www.data-io.de or e-mail: salesgmbh@data-io.de 

Meggitt Sensing Systems adds three-channel Endevco® DC
differential voltage amplifier to guaranteed Instock™ Program

Meggitt Sensing Systems, a Meggitt group division, has announced the expansion of its worldwide Guaranteed InStock™ program to include the immediate availability of the Endevco® model 136 three-channel voltage amplifier, designed for use with bridge-type or differential output accelerometers and pressure transducers, in support of general purpose laboratory testing applications.

Featuring an industry standard bench mount configuration and four selectable excitation voltage levels, the Endevco® model 136 offers a standard RS-232 serial communications interface with either manual or computer programmable configuration. Using the supplied PC software setup, the model 136 allows for effective control of up to 60 measurement channels within automated test setups. Operation and programming are achieved via the LED illuminated front panel with adjustable gain range of 0 to 1000, and a flexible setup allows for user match of sensor sensitivities with output scaling per Engineering Units in mV/G.

The Endevco® model 136 contains a rear panel RJ-11 connector for the RS-232 serial communications port, an input power connector, a per-channel BNC output connector, and a 9-pin "D" input connector. Units also feature a built-in four-pole low-pass filter. The standard unit is powered by 90-264 VAC, 50/60 Hz and features a 200 kHz bandwidth (-3 dB corner) with auto zero and shunt calibration. A 12 VDC power option is also available for portable automotive testing applications. Recommended accessories for the Endevco® model 136, sold separately, include a 19-inch rack mount adapter (model 31979) for installation of up to three units and a series of low-pass filter modules (model 31875-xxxx). For further information, view website: www.meggittsensingsystems.com  Refer to page 266